Labels Milestones
BackX 6.25mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.8mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.5x2.5mm package, pitch 0.5mm; see section 10.3 of https://www.parallax.com/sites/default/files/downloads/P8X32A-Propeller-Datasheet-v1.4.0_0.pdf 44-Lead Plastic Shrink Small Outline (SO) - Wide, 5.3 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 28 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 leads molded, narrow, drill 0.75mm (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 transistor TO-92 2-pin leads in-line, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 506CM (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506CE.PDF DD Package; 14-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [TQFP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator JST VH series connector, 505405-0670 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B13B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-14DP-0.5V, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8L_TDFN_2x3_MNY_C04-0129E-MNY.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BB), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1410, with PCB locator, 12 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B16B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53048-0710, 7 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-10A2, example for new part number: AE-6410-12A example for new mpn: 39-28-924x, 12 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 40 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation BD), generated with kicad-footprint-generator Molex SPOX Connector System, 43045-0400 (alternative finishes: 43045-062x), 3 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator Molex.
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