Labels Milestones
BackPlastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_8_05-08-1718.pdf DFN, 8 Pin (https://www.ti.com/lit/ds/symlink/lm5017.pdf#page=34), generated with kicad-footprint-generator JST PUD series connector, BM05B-ACHSS-A-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator Molex Mini-Fit Sr. Power Connectors, old mpn/engineering number: 5566-04A2, example for new mpn: 39-28-x18x, 9 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 5.6, Wuerth electronics 9774020951 (https://katalog.we-online.de/em/datasheet/9774020951.pdf), generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board.
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