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Connector, 43160-2105, With thermal vias in pads, 5 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 72-Lead Frame Chip Scale Package - 9x9 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf 48-Lead Thin Quad Flatpack (PT) - 10x10x1 mm Body, 2.00 mm [TQFP] (see Microchip Packaging Specification 00000049BS.pdf DCB Package 8-Lead Plastic Dual Flat, No Lead Package - 3x3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm.

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