Labels Milestones
BackPitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FG676 FGG676 Spartan-7 BGA, 14x14 grid, 8x8mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD.
- 4.0x4.0x0.8 mm Body [HTSSOP.
- System, 5268-06A, 6 Pins (http://www.molex.com/pdm_docs/sd/559320530_sd.pdf), generated with.
- 5.25mm 206mil JPin SMD 4x-dip-switch SPST.