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24.13 mm (950 mils), SMDSocket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 10-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62.

• 2.065 (end 2.811 2.065 (end 2.811 -1.04.
• Switches (all go to same.
• 0.469113 0.0975757 vertex 5.00013 7.48323 4.51216 facet normal.

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