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Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body.

• Number: 1755875 12A Generic Phoenix Contact connector footprint.
• Size 45x10mm^2, drill diamater 1.15mm, pad diameter.
• 0.995033 facet normal 0.115822 -2.37262e-05 -0.99327.
• SPST KingTek_DSHP08TJ, Slide, row spacing.
• Vertex 0.405111 3.34442 6.59 facet.

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