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B.Paste" "Notes": "Layer B.Cu" "Notes": "Layer F.SilkS" "Notes": "Layer F.Mask" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.Paste" "Notes": "Layer F.Paste" "Notes": "Layer F.Cu" "Notes": "Layers L1/L2" "Notes": "Layer F.SilkS" "Notes": "Layer F.SilkS" "Notes": "Layer F.Paste" "Notes": "Layer B.Cu" "Notes": "Layer B.Cu" "Notes": "Layer F.Paste" "Notes": "Layer B.Paste" "Notes": "Layer B.Mask" "Notes": "Layer F.Mask" "Notes": "Layer B.Cu" "Notes": "Layer B.SilkS" ; DRILL file {KiCad 5.1.10-88a1d61d58~90~ubuntu20.04.1} date Sat Aug 7 13:39:59 2021 ; DRILL file {KiCad 7.0.11-7.0.11~ubuntu22.04.1} date Tue Mar 5 20:19:51 2024 Copper Layer Stackup: ============================================================= L1 : F.Cu front L2 : B.Cu back Drill file 'precadsr-panel.drl' contains plated through holes are merged with plated holes count 16 Not plated through holes: ============================================================= From a22bca6d29ddc0a54597dab4d11ad9ab7e48e3c6 Mon Sep 17 00:00:00 2001 From 54f1a61ba5f9983533e06b3eb1217b0ac5f22e05 Mon Sep 17 00:00:00 2001 Subject: [PATCH] edits README.md file - Before producing, confirm footprint dimensions for capacitors, diodes (inc. LEDs), and barrel power jack 2mm 2.5mm KLDX-0202-BC KLDX-0202-AC 1.10mm Pitch microSD Memory Card Connector, Normal Type, Outer Tail, Without Ejector (https://global.kyocera.com/prdct/electro/product/pdf/5638.pdf SD Card Connector, Normal Type, Outer Tail, Spring Eject Type.

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