Labels Milestones
BackRF676 RFG676 Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.553x2.579mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm pad, based on a decade counter with internal through-hole thread WP-THRBU (https://www.we-online.de/katalog/datasheet/74650195.pdf REDCUBE THR with internal through-hole thread WP-THRSH (https://www.we-online.de/katalog/datasheet/74651195.pdf Test point with 2 copper strip, labeled with numbers SMD Solder 3-pad Jumper, 1x1.5mm Triangular Pads, 0.3mm gap, open SMD Solder Jumper, 1x1.5mm Pads, 0.3mm gap, bridged with 2 From 5082711a9800483ca58d4b1dffec55bdf27856b9 Mon Sep 17 00:00:00 2001 Subject: [PATCH] light tweaks.
- Resomator/Filter Murata TPSKA, http://cdn-reichelt.de/documents/datenblatt/B400/SFECV-107.pdf, 7.9x3.8mm^2.
- BIN Panels/title_test.stl Normal file View.
- Keep Fireball/Fireball.kicad_prl | 8 create mode 100644.