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Pitch, DIN 41651 / IEC 60603-13, double rows, 9.5mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole straight socket strip, 1x06, 2.54mm pitch, 6mm pin length, double rows Through hole socket strip THT 1x06 1.27mm single row (from Kicad 4.0.7!), script generated Surface mounted pin header THT 2x34 2.54mm double row surface-mounted straight socket strip, 1x05, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole pin header SMD 2x02 1.27mm double row Through hole angled pin header, 1x40, 1.00mm pitch, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 2x15, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x13, 2.54mm pitch, 8.51mm socket length, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip THT 2x20 2.00mm double row Through hole IDC header, 2x05, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole straight socket strip, 2x31, 1.27mm pitch, single row (from Kicad 4.0.7), script generated Through hole angled socket strip SMD 1x11 2.54mm single row Surface mounted socket strip SMD 1x14 2.54mm single row Through hole socket strip THT 1x22 1.27mm single row Through hole socket strip THT 1x29 2.54mm single row style1 pin1 left Surface mounted pin header SMD 1x15 1.27mm single row style1 pin1 left Surface mounted pin header THT 2x18 1.00mm double row surface-mounted straight socket strip, 1x31, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments DSBGA BGA Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 1.5195x1.5195x0.600mm, 8 ball 3x3 area grid, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm.

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