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Raster, 3.294x3.258mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf UFBGA-201, 15x15 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=260, NSMD pad definition Appendix A BGA 484 1 FB484 FBG484 FBV484 Artix-7, Kintex-7 and Zynq-7000 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=77, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Surface mounted pin header THT 1x30 1.27mm single row style2 pin1 right Through hole angled pin header SMD 2x23 2.00mm double row surface-mounted straight pin header, 1x15, 1.00mm pitch, single row style1 pin1 left Surface mounted socket strip THT 1x16 1.27mm single row (from Kicad 4.0.7), script generated Surface mounted socket strip THT 1x13 5.08mm single row (from Kicad 4.0.7), script generated Through hole angled pin header, 2x19, 1.00mm pitch, double rows Through hole Samtec HPM power header series 11.94mm post length, 1x03, 5.08mm pitch, single row Through hole angled pin header, 2x19, 1.00mm pitch, single row style2 pin1 right Through hole straight pin header, 2x21, 2.54mm pitch, single row Surface mounted pin header THT 2x29 1.27mm double row Through hole pin header THT 1x17 2.54mm single row Through hole angled pin header THT 2x31 2.00mm double row.

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