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Thermally Enhanced Thin Shrink Small Outline (ST)-4.4 mm Body [TSSOP] with exposed pad (http://cds.linear.com/docs/en/datasheet/34301fa.pdf SSOP 0.65 exposed pad (http://www.onsemi.com/pub/Collateral/NCP4308-D.PDF WDFN, 12 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-lqfn/05081530_B_LQFN12.pdf), generated with kicad-footprint-generator Soldered.

Your choice of sitching hardware).
Hardware/PCB/precadsr/ao_tht.pretty/analogoutput.kicad_mod Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-B_SilkS.gbr Normal file.

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