3
1
Back

DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip THT 2x11 2.00mm double row Through hole angled pin header, 1x31, 1.27mm pitch, 4.0mm pin length, single row Surface mounted pin header THT 2x07 1.27mm double row.

New Pull Request