Labels Milestones
BackMerged pull request synth_mages/MK_VCO#5
everything done as a result of switching to pcb-mounted panel components and interconnects between middle and bottom boards. Final work on PCB sandwich, making some final-ish decisions about connecting to front panel Added schmancy pcb for v2 front panel to integer pseudo-origin, remove testing text, decrease title label font size to 9mm and align it precisely for repeatability d6ebbf1c1b Collect other files not yet included in repo Latest commits for file Schematics/Kassutronics_Slope_Build_Docs_2.0A.pdf Sequencer based on https://www.analog.com/media/en/technical-documentation/data-sheets/8063fa.pdf Altera BGA-36 V36 VBGA BGA-48 - pitch 0.8 mm Highspeed card edge card connector socket for 2.36mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm Highspeed card edge card connector socket for 1.57mm PCBs, vertical (source: https://suddendocs.samtec.com/prints/hsec8-1xxx-xx-xx-dv-x-xx-footprint.pdf 0.8 mm BGA-64, 10x10 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YZF, YZF0016, 2.39x2.39mm, 16 Ball, 4x4 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; see section 7.5.
- 5.385247e-01 -3.218702e-04 vertex -9.143382e+01 1.029420e+02.
- (end 152.25 121.75 (end.
- Elektronik, Wuerth_MAPI-3020, 3.0mmx3.0mm Inductor.