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Bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 482, 4.2x3.95mm, 90 Ball, X-staggered 13x8 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF, https://pdfserv.maximintegrated.com/package_dwgs/21-100302.PDF NXP VFBGA-42, 3.0x2.6mm, 42 Ball, 6x7 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=273, https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=284, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=84, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole straight socket strip, 2x33, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Surface mounted socket strip THT 1x09 1.27mm single row style1 pin1 left Surface mounted socket strip SMD 1x31 2.54mm single row Through hole angled pin header THT 2x30 2.54mm double row Through hole pin header THT 1x09 1.00mm single row Through hole pin header SMD 1x33 1.27mm single row Through hole socket strip THT 2x17 1.00mm double row Through hole angled socket strip, 2x21, 2.00mm pitch, 4.2mm pin length, single row Surface mounted pin header SMD 2x31 2.54mm double row Through hole straight pin header, 1x36, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows Through hole socket strip THT 1x34 1.27mm single row Surface mounted socket strip THT 1x12 2.00mm single row Through hole IDC header, 2x15, 2.54mm pitch, double rows Through hole pin header SMD 1x14 1.27mm single row Through hole socket strip THT 1x40 2.54mm single row Through hole straight socket strip, 2x08, 2.00mm pitch, single row Surface mounted socket strip SMD 2x18 2.00mm double row Through hole.

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