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205-00298 pitch 10mm size 65x10.3mm^2 drill 1.3mm pad 2.5mm terminal block Metz Connect Type175_RT02705HBLC pitch 7.5mm size 17.3x14mm^2 drill 1.15mm pad 3mm Terminal Block Phoenix MKDS-1,5-2-5.08, 2 pins, http://www.kingbright.com/attachments/file/psearch/000/00/00/L-43GD(Ver.12B).pdf LED diameter 4.0mm Plated Hole as test Point, diameter 5.0mm z-position of LED center 9.0mm, 2 pins, diameter 3.0mm 2 pins LED_Rectangular, Rectangular, Rectangular size 5.0x2.0mm^2 3 pins THT ceramic resonator filter CSTLSxxxX Ceramic Resomator/Filter 6.0x3.0mm^2, length*width=6.0x3.0mm^2 package, package length=7.0mm, package width=2.5mm, 3 pins UFQFPN 20-lead, 3 x 6mm drills 3 pin connector, https://www.te.com/commerce/DocumentDelivery/DDEController?Action=showdoc&DocId=Customer+Drawing%7F215079%7FY1%7Fpdf%7FEnglish%7FENG_CD_215079_Y1.pdf%7F215079-4 connector TE-Connectivity Micro-MaTch Vertical 215079-6 7-215079-6 TE-Connectivity Micro-MaTch Vertical 215079-6 7-215079-6 TE-Connectivity Micro-MaTch female-on-board top-entry thru-hole 6 pin 0.5mm Pitch http://www.st.com/resource/en/datasheet/ecmf02-2amx6.pdf UQFN DFN 0.5 ST 20-Lead Plastic Quad Flat, No Lead Package (MD) - 4x4x0.9 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 10-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 22-pin zero insertion force socket, though-hole, row spacing 8.89 mm (350 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 24-lead though-hole mounted DIP package, row spacing 5.08mm, pin-spacing 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Horizontal RM 4.58mm IPAK TO-251-3, Vertical, RM 0.9mm, staggered type-1 TO-220-4, Horizontal, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 2.54mm staggered type-2 TO-220F-9 Vertical RM 2.54mm TO-247-5, Vertical, RM 5.08mm, see http://www.onsemi.com/pub/Collateral/FFPF10F150S-D.pdf TO-220F-2 Vertical RM 5.08mm TO-220-2, Vertical, RM 1.27mm, staggered type-1, see http://www.st.com/resource/en/datasheet/tda7391lv.pdf TO-220-11 Horizontal RM 2.54mm staggered type-1 TO-247-2, Horizontal, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Vertical RM 5.08mm TO-220F-2, Vertical, RM 2.54mm TO-220-4, Vertical, RM 0.9mm, staggered type-1 TO-220F-9 Vertical RM 0.97mm Multiwatt-9 staggered type-1 TO-220-7 Vertical RM 2.54mm TO-247-5, Horizontal, RM 5.08mm, see https://www.centralsemi.com/PDFS/CASE/TO-220-2PD.PDF TO-220-2.

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