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506CE.PDF DD Package; 8-Lead Plastic Small Outline (SS)-5.30 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Shrink Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 SSO, 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 3.415x3.535x0.625mm, 64 ball 8x8 area grid, YBG pad definition, https://www.ti.com/lit/ds/symlink/lmg1020.pdf, https://www.ti.com/lit/ml/mxbg078z/mxbg078z.pdf BGA 6 0.4 YFF0006 Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 3x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.4mm socket length, double rows Through hole angled pin header, 2x22, 2.54mm pitch, 8.51mm socket length, single row Surface mounted socket strip THT 1x07 1.00mm single row Through hole socket strip SMD 1x17 1.00mm single row style2 pin1 right Through hole angled socket strip, 2x35, 2.00mm pitch, double rows Through hole pin header THT 1x09 2.54mm single row style2 pin1 right Through hole angled pin header, 1x18, 2.54mm pitch, 6mm pin length, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole vertical IDC header THT 2x29 1.27mm double row surface-mounted straight socket strip, 2x22, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box header THT 1x27 2.54mm single row Surface mounted pin header THT 2x12 2.54mm double row Through hole angled pin header, 2x14, 2.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole straight socket strip, 1x37, 2.00mm pitch, single row Surface mounted socket strip THT 2x07 1.27mm double row Through hole.

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