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BackUnescape Hardware/PCB/precadsr/ao_tht.pretty/PPTC_RXEF025.kicad_mod Normal file Unescape REP: repique CAX: caixa MSD: mid surdo (sometimes MS1, MS2, etc, if multiple measures or variations BSD: back surdo For this tab pidgin, 'l' or 'L' means left hand, 'r' or 'R' means right hand, capital letters mean accents (play much louder). 'B' means Both hands; something repique does occasionally Mid surdos often vary the sticking by personal preference. From cd18ed43dcb6067b24f5a336bfd547b1947b9869 Mon Sep 17 00:00:00 2001 Subject: [PATCH] Move LED resistors next to transistors to save on panel wires fewer_panel_wires Latest commits for file PSU/PSU.md //clock rate (rv11 // 1 rotary switch, 5+ positions 10 LEDs - Consider: 1 simple on/off switch/button/knob/etc. Cb3a50e19a More tweaks after pro review "different_unit_footprint": "error", "different_unit_net": "error", "duplicate_reference": "error", "duplicate_sheet_names": "error", More tweaks after pro review "multiple_net_names": "warning", "net_not_bus_member": "warning", "no_connect_connected": "warning", "no_connect_dangling": "warning", "pin_not_connected": "error", "pin_not_driven": "error", "pin_to_pin": "warning", "power_pin_not_driven": "error", "similar_labels": "warning", More tweaks after pro review 2 From 398c2b234cc710f69bb9085257ff5dbf3509a410 Mon Sep 17 00:00:00 2001 Subject: [PATCH 12/13] Update Schematics/schematic_bugs_v1.md dcaec240831d28b722a7d7988287c76a1461e439 more fixes dcaec240831d28b722a7d7988287c76a1461e439 more fixes glide fix Notes from debugging More notes C10, C14 too small for a single 0.5 mm² wire, basic insulation, conductor diameter 0.65mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV, 39 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_noLead_generator.py Nexperia wafer level chip-size package; 15 bumps (6-3-6), 2.37x1.17mm, 15 Ball, 6x3 Layout, 0.4mm Pitch, https://pdfserv.maximintegrated.com/package_dwgs/21-100168.PDF XBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition Appendix A BGA 484 1 FG484 FGG484 Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l031f6.pdf WLCSP-25, 5x5.
- -0.988483 -0.0979878 0.115323 facet normal 0.0221491.
- 0.923222 vertex 0.183929 9.12468 3.76384 facet normal 7.274189e-01.
- Strip, HLE-113-02-xx-DV-TE, 13 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf.