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LowProfile 6x-dip-switch SPST Omron_A6H-6101, Slide, row spacing 7.62 mm (300 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), SMDSocket, LongPads 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 18-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 12-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_6_05-08-1703.pdf 6-Lead Plastic Small Outline (SS)-5.30 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf SSOP28: plastic shrink small outline package; 8 leads; body width 7.5 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot361-1_po.pdf TSSOP, 28 Pin (JEDEC MO-153 Var EC-1 https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_noLead_generator.py DFN, 8 Pin (https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BME680-DS001-00.pdf#page=44), generated with kicad-footprint-generator Tantalum Capacitor SMD Kemet-C (6032-28 Metric), IPC_7351 nominal, (Body size source: https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MCV_1,5/5-GF-3.81; number of pins: 09; pin pitch: 5.08mm; Angled; threaded flange || order number: 1803455 8A 160V Generic.

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