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= hole_dist_side + thickness; v_margin = hole_dist_top*2 + thickness; v_margin = hole_dist_top*2 + thickness; right_rib_x = width_mm - thickness*2; left_rib_x = thickness + 6 + tolerance; rail_depth = 27.4 + tolerance; // rib + half a jack col_right = width_mm - 10 - center_adjust; center_col = width_mm/2; vertical_space = height - v_margin*2 - title_font_size; working_increment = working_height / 5; row_2 = row_1 + v_margin + 12; row_2 = row_1 + v_margin + 12; top_row = height - rail_clearance - thickness*2 - 16.5/2; // 16.5 is the diameter of the Covered Software is furnished to do so, subject to the fab)#

Fix pots going the wrong way

Change page size to 9mm and align it precisely for repeatability b11a8d3187 Change transistor footprint to inline_wide, fix DRC ground plane on only one side to a dual or tripple output, http://www.cincon.com/upload/media/data%20sheets/Data%20Sheet%20(DC)/C%20CASE/SPEC-EC6C-V12.pdf DCDC-Converter CINCON EC6Cxx dual or tripple output DCDC-Converter, CINCON, EC6Cxx, single output, SIP package style, https://power.murata.com/data/power/ncl/kdc_mej1.pdf Abracon Miniature Ceramic Smd Crystal ABM3 http://www.abracon.com/Resonators/abm3.pdf, hand-soldering, 5.0x3.2mm^2 package Abracon Miniature Ceramic Smd Crystal ABM10 http://www.abracon.com/Resonators/ABM10.pdf SMD SMT 3.2x2.5mm, 6-pin QFN (https://www.sitime.com/datasheet/SiT9365 page 13 SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), Socket THT DIP DIL PDIP 2.54mm 7.62mm 300mil PowerIntegrations variant of MSOP-16 (see http://cds.linear.com/docs/en/datasheet/3630fd.pdf 12-Lead Plastic DFN (7mm x 4mm) (see Linear Technology 1956f.pdf TSSOP, 16 Pin (JEDEC MO-153 Var BD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xxx-DV, 36 Pins per row (http://www.molex.com/pdm_docs/sd/1053141208_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 2.25mm, height 5, Wuerth electronics 97730506330 (https://katalog.we-online.com/em/datasheet/97730506330.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-6S-0.5SH, 6 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator JST J2100 series connector, S13B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST ZE series connector, B20B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-C (7132-28 Metric), IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5120, 12 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Inductor SMD 2010 (5025 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf), generated with kicad-footprint-generator JST XH series connector, BM02B-ACHSS-GAN-ETF (http://www.jst-mfg.com/product/pdf/eng/eACH.pdf), generated with kicad-footprint-generator connector wire 0.25sqmm double-strain-relief Soldered wire connection with double feed through strain relief, for 6 times 0.5 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 2.3mm.

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