Labels Milestones
Back14x14mm body, 9.5mm sq thermal pad HTSSOP32: plastic thin shrink small outline package; 10 leads; body width 4.4 mm; Exposed Pad [eTSSOP] (see Microchip Packaging Specification 00000049BS.pdf DFN, 10 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/00001725D.pdf (Page 9)), generated with kicad-footprint-generator Hirose DF11 through hole, DF13-11P-1.25DSA, 11 Pins per row (http://www.molex.com/pdm_docs/sd/1053131208_sd.pdf.