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FFV1157 FF1158 FFG1158 FFV1158 Virtex-7 BGA, 42x42 grid, 42.5x42.5mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 0.9x1.9mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1 FF1761 FFG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=307, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Through hole angled pin header, 1x04, 1.27mm pitch, 4.4mm socket length, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x26 2.54mm single row Surface mounted socket strip THT 2x37 1.27mm double row surface-mounted straight socket strip, 1x17, 2.00mm pitch, single row style2 pin1 right Through hole pin header SMD 2x15 1.27mm double row Through hole straight pin header, 2x19, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header THT 2x15 2.54mm double row surface-mounted straight pin header, 2x36, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole horizontal IDC box header THT 1x36 1.27mm single row style2 pin1 right Through hole angled pin header THT 1x20 2.54mm single row style2 pin1 right Through hole angled pin header THT 2x20 2.54mm double row Through hole.

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