Labels Milestones
BackRectifier, https://www.bourns.com/docs/Product-Datasheets/CD-DF4xxSL.pdf Surface Mount Package (https://www.fairchildsemi.com/package-drawings/ML/MLSOP08A.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), SMDSocket, LongPads 22-lead though-hole mounted high-volatge DIP package (based on standard DIP-4), row spacing 7.62 mm (300 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET M4 MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MA MOSFET Infineon DirectFET MT MOSFET Infineon DirectFET SQ MOSFET Infineon DirectFET L8 MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET SH MOSFET Infineon PLCC, 20 pins, single row Through hole pin header, 2x21, 1.00mm pitch, double cols (https://gct.co/pdfjs/web/viewer.html?file=/Files/Drawings/BD091.pdf&t=1511594177220), script generated Through hole angled pin header, 2x31, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 1x01 2.00mm single row style1 pin1 left Surface mounted.
- LowProfile 1x-dip-switch SPST Copal_CVS-01xB, Slide, row spacing.
- 1760 1 FH1761 FHG1761 Virtex-7 BGA.