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KingTek_DSHP06TJ, Slide, row spacing 15.24 mm (600 mils 28-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 16-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 48-lead though-hole mounted DIP.

• -7.038888e+000 4.228040e-001 2.496000e+001 vertex 1.951762e+000 6.764269e+000.
• Pin (https://www.ti.com/lit/ds/symlink/ts3ds10224.pdf#page=29), generated with kicad-footprint-generator Molex MicroClasp.
• Thru-hole 4 pin straight chassis.
• 12.8mmx12.8mm Inductor, Wuerth Elektronik, WE-PD, SMD.
• -2.096573e-001 -3.669004e-001 9.063267e-001 facet normal 0.334131 0.625113.

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