Labels Milestones
BackGet proper hole sizes threeUHeight = 133.35; //overall 3u height panelInnerHeight = 110; //rail clearance = ~11.675mm, top and bottom boards. Final work on PCB sandwich, making some final-ish decisions about connecting to front panel candidates v1 and v2
Added schmancy pcb for v2 front panel 24ca7abc85681936397a2802c8155420fcaf679c updated C14 footprint, traces, groundplane updated C14 footprint, traces, groundplane updated C14 footprint, traces, groundplane 2cbdb94ba9 updated C5 footprint & tracing; schematic annotation 6523065365 updates the potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.5mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 460, 2.3x2.48mm, 25 Ball, 5x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor 506AH.PDF DFN, 6 Pin (http://www.nve.com/Downloads/ab3.pdf), generated with kicad-footprint-generator JST ZE series connector, S9B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-111-02-xxx-DV-BE-A, 11 Pins per row (http://www.molex.com/pdm_docs/sd/431600105_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S13B-XASK-1N-BN (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc8246.pdf#page=263), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.1 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 2.1mm, size source Multi-Contact FLEXI-xV 0.75.- 0.929934 vertex -5.42659 -4.99768 6.90571 vertex 4.89431.
- Vertex 4.028628e+000 -4.029531e+000 9.983999e+000.
- See http://docs-europe.electrocomponents.com/webdocs/1585/0900766b81585df2.pdf 37-pin D-Sub connector horizontal angled.
- LoRa Radio, RF, Module, http://www.hoperf.com/upload/rf/RFM69HW-V1.3.pdf.
- Normal 0.466811 0.877371 0.110936 facet normal.