Labels Milestones
BackBGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=264, NSMD pad definition Appendix A BGA 900 1 FB900 FBG900 FBV900 Kintex-7 and Zynq-7000 BGA, 22x22 grid, 23x23mm package.
- Thruhole Diode SMC (DO-214AB) Handsoldering Diode SMF (DO-219AB.
- 6.301707e-01 2.864772e-03 -7.764513e-01 vertex -1.054006e+02.