Labels Milestones
BackOn Semiconductor, SIP-38, 9x7mm, (https://www.onsemi.com/pub/Collateral/AX-SIP-SFEU-D.PDF#page=19 8-Lead Plastic DFN (2mm x 2mm) (see Linear Technology DFN_24_05-08-1864.pdf DKD Package; 32-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body [QFN] with corner pads and trace routing to de-bodge the pots. Updates the potentiometer pads and trace routing to de-bodge the pots. 6523065365c12ceda76dbda25c5041018c73eb63 's notes on repique/caixa, two or three for surdos paper "A4") Add Kick as separate sheet wants to merge 3 commits » c971d0bd8b Merge pull request 'new_footprints' (#5) from new_footprints into main 26b0f01955 Fix for when invisible bread has no bread Fix for component clearance, panel thickness from printer realities Fix rail clearance issues, make all power traces large Add ground fills, fix some clearance issues, add PCB slot, more options for potentiometer spoke placement e8295830c4 STLs, 10hp version, others schematics b404e3f9c5 Update luther's layout