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Be the same, the other Ground planes: ground planes are copper fill applied everywhere there isn't a trace already - use spokes where ground planes connect to holes - these gaps reduce heat conduction during soldering ground plane created pull request 'More schematics' (#3) from schematic by Eeschema 5.1.10-88a1d61d58~90~ubuntu20.04.1 **Component Count:** 74 **Component Count:** 74 Latest commits for file Synth Mages Power Word Stun Panel.kicad_pro create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Power_Header.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/PinHeader_1x10_P2.54mm_Vertical.kicad_mod delete mode 100644 Schematics/OttosIrresistableDance/OttosIrresistableDance.kicad_pro git clone git@gitlab.com:rsholmes/precadsr.git git submodule update ``` ``` git clone --recurse-submodules git@gitlab.com:rsholmes/precadsr.git ``` ``` git clone --recurse-submodules git@github.com:holmesrichards/precadsr.git ``` 4d5fa6d903 Delete 'Panels/futura light bt.ttf' Futura BT font files The body text, captions, sub-headers, etc. In AD&D 1e spell names in Filmoscope Quentin/Panels' c58f541d7e93b3fa0676ab29736db865cc42ef96 Delete '3D Printing/AD&D 1e spell names in Filmoscope Quentin' b96c823428337e1169ae4a0f1d50e46562744447 Add '3D Printing/Panels/AD&D 1e spell names rendered as raster using Filmoscope Quentin font.

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