3
1
Back

Socket 20-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, LongPads 32-lead dip package, row spacing 15.24 mm (600 mils), Socket 48-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 6.7x14.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST Omron_A6H-4101, Slide, row spacing 7.62 mm (300 mils), LongPads 28-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row.

New Pull Request