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Size 52.5x7.6mm^2, drill diamater 1.15mm, pad diameter 2.1mm, size source Multi-Contact FLEXI-E_0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex MicroClasp horizontal Molex KK 396 Interconnect System, old/engineering part number: 09-65-2128, 12 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0403-5-51, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Thick Film Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf Chip Resistor Network, ROHM MNR04 (see mnr_g.pdf Chip Resistor Network, ROHM MNR35 (see mnr_g.pdf Chip Resistor Network, ROHM MNR02 (see mnr_g.pdf Chip Resistor Array, Wave soldering, Vishay CRA04P (see cra04p.pdf Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf Chip Resistor Network, ROHM MNR34 (see mnr_g.pdf Precision.

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