Labels Milestones
BackD 5x DIP Switch, Single Pole Single Throw (SPST) switch, temperature dependent K temerature switch dual double-pole single-throw OFF-ON D Single Pole Single Throw (SPST) switch, small symbol D 12x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D 2x DIP Switch, Single Pole Single Throw (SPST) switch, small symbol D Switch, triple pole double throw, separate symbols K switch SPST right angle, http://www.ckswitches.com/media/1428/os.pdf 1x-dip-switch SPST , Slide, row spacing 8.61 mm (338 mils), body size 10.8x26.96mm 10x-dip-switch SPST Omron_A6S-1010x, Slide, row spacing 15.24 mm (600 mils 48-lead though-hole mounted DIP package, row spacing 5.25 mm (206 mils), body size 9.78x14.88mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 12-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size 10.8x11.72mm 4x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 9x-dip-switch SPST , Piano, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 26.67 mm (1050 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil LowProfile 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), missing pin 5, row spacing 7.62 mm (300 mils), Socket 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm SMD DIP DIL PDIP 2.54mm 22.86mm 900mil SMDSocket SmallPads 64-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, 4x4mm body, pitch 0.5mm UFBGA-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303zd.pdf WLCSP-100, 10x10 raster, 4.201x4.663mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UFBGA-15, 4x4, 3x3mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f410t8.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f100v8.pdf TFBGA-100, 10x10 raster, 4.201x4.663mm package, pitch 0.5mm; see section 6.3 of.
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