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In-line (large body variant of 10-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

• 1.3mm, hole diameter 1.2mm, length 11.3mm, width 2.8mm.
• Bodge area. Future Module Ideas Pages Fab.
• Bornier5 simple 6pin terminal block, pitch 5.08mm.
• Series, http://cdn-reichelt.de/documents/datenblatt/B400/XO32.pdf, 3.2x2.5mm^2 package Abracon Miniature Ceramic Smd.

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