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Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 1.27mm SSOP, 8 Pin (https://media.digikey.com/pdf/Data%20Sheets/Rohm%20PDFs/BD9G341EFJ.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 20 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_20_05-08-1742.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 0603 (1608 Metric), square (rectangular) end terminal, IPC_7351.

-1.01854 -7.22332 7.61242 vertex -5.83103 4.37272.
\npot pin 1 x 1 mm, 734-142.
5.689145e-001 7.524708e-001 facet normal -1.087091e-001 -4.840734e-004 9.940735e-001.
6.281633e-001 4.347366e+000 2.488700e+001 facet normal 0.188007 -0.291191.

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