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KingTek_DSHP07TS, Slide, row spacing 7.62 mm (300 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), see http://cdn-reichelt.de/documents/datenblatt/A400/HDBL101G_20SERIES-TSC.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (https://www.diodes.com/assets/Package-Files/TO92S%20(Type%20B).pdf TO-92 leads molded, wide, drill 0.75mm, handsoldering variant with enlarged pads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot505-1_po.pdf TSSOP, 8 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/CP_8_19.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-A, 23 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-2P-1.25DSA%2850%29/), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-138-02-xxx-DV-BE, 38 Pins per row (https://www.hirose.com/product/document?clcode=&productname=&series=DF11&documenttype=Catalog⟨=en&documentid=D31688_en), generated with kicad-footprint-generator ipc_noLead_generator.py WLCSP-35, 2.168x2.998mm, 35 Ball, 7x5 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SO, 8 Pin (http://www.macronix.com/Lists/Datasheet/Attachments/7534/MX25R3235F,%20Wide%20Range,%2032Mb,%20v1.6.pdf#page=80), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41792-0002 example for new part number: A-41792-0006 example for new mpn: 39-29-4129, 6 Pins (http://www.molex.com/pdm_docs/sd/559320210_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body with Exposed Pad Variation; (see NXP sot054_po.pdf to-92 sc-43 sc-43a sot54 PA33 temperature sensor diode.

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