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3EP 16.0x17.2mm Pitch 1mm ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm ST PowerSSO-36 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271] (http://www.st.com/resource/en/datasheet/tda7492p.pdf, http://freedatasheets.com/downloads/Technical%20Note%20Powersso24%20TN0054.pdf ST PowerSSO-24 1EP 7.5x10.3mm Pitch 0.8mm [JEDEC MO-271.

• 3x3 array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf.
• 3.2x1.5mm^2 package SMD Crystal.
• Pin (http://ww1.microchip.com/downloads/en/devicedoc/00002117f.pdf#page=69), generated with kicad-footprint-generator.

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