Labels Milestones
BackESOP-12B SMT Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), LongPads 48-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), SMDSocket, LongPads 28-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 5-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size 10.8x19.34mm 7x-dip-switch SPST , Piano, row spacing 6.73 mm (264 mils), body.
- Http://www.onsemi.com/pub/Collateral/NLSV2T244-D.PDF dfn udfn dual flat OnSemi VCT.
- Pitch=49mm, , length*diameter=42.5*20mm^2, Electrolytic Capacitor.