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-> 71984 bytes 3D Printing/Panels/FIREBALL VCO.png create mode 100644 Panels/luther_triangle_vco_quentin_v3_blank.stl.stl create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Alpha_RD901F-40-00D_Single_Vertical_CircularHoles_centered.kicad_mod create mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-F_Cu.gbr create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/DIN5.kicad_mod create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Pot_Hole.kicad_mod create mode 100644 Panels/luther_triangle_vco_quentin_v2.scad create mode 100644 Hardware/Panel/precadsr-panel/precadsr-panel.sch create mode 100644 Images/IMG_6771.JPG create mode 100644 Panels/Font files/Quentincaps.ttf | Bin 0 -> 787001 bytes ...1995 - MIDI 1.0 Detailed Specification.pdf Normal file View File Schematics/Luthers_VCO_schematic.pdf Normal file View File 3D Printing/Pot_Knobs/Pot3.STL Executable file View File Synth Mages Power Word Stun Panel.kicad_prl | 77 Synth Mages Power Word Stun Panel.kicad_pro | 229 Synth Mages Power Word Stun Panel.kicad_prl | 2 | 10uF | Polarized capacitor | | | Screws, nuts, and spacers (see [build notes](build.md | | C2, C5, C6, C8, C9, C11, C12. - C10, C14 too small for a single 2.5 mm² wires, basic insulation, conductor diameter 0.5mm, outer diameter 1.7mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex CLIK-Mate series connector, S20B-PUDSS-1 (http://www.jst-mfg.com/product/pdf/eng/ePUD.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SSOP48: plastic shrink small outline package; 28 leads; body width 3 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot337-1_po.pdf SSOP16: plastic shrink small outline package; 40 leads (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 505AB (see ON Semiconductor 122BS.PDF PQFP, 100 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-80DP-0.5V, 80 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py eSIP-7C Vertical Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 8.9 mm (350 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 9x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x7.26mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 8x-dip-switch SPST , Slide, row spacing 11.48 mm (451 mils 22-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 28-lead though-hole mounted.

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