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BackSmall outline package; 44 leads; body width 7.5 mm; (see NXP sot054_po.pdf TO-92 horizontal, leads molded, narrow, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot371-1_po.pdf STC SOP, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-0430, 4 Pins per row.
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