Labels Milestones
Back4 Ball, 2x2 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 468, 3.15x3.13mm, 49 Ball, 7x7 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments EUW 7 Pin Double Sided Module Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD.
- Normal 5.019341e-001 -8.605046e-001 8.714356e-002 vertex -1.625209e+000 4.817784e+000 2.470218e+001.
- (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Hirose.
- Normal 7.257997e-001 -6.879061e-001 0.000000e+000.
- -0.0620831 -0.0776614 0.995045 vertex -9.30698 -1.4028 20.0916 vertex.