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2.54mm 24.13mm 950mil SMDSocket LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket, LongPads 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x29.5mm 11x-dip-switch SPST , Piano, row spacing 15.24 mm (600 mils), Socket, LongPads 22-lead though-hole mounted DIP package, row spacing 6.15 mm (242 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 6.7x32.04mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 11.48 mm (451 mils 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 14-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.5mm UFBGA-64, 8x8 raster, 5x5mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12 raster, 4.095x5.094mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.8mm; http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#p495 TFBGA-216, 15x15 raster, 13x13mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=262, NSMD pad definition Appendix A Artix-7 and Zynq-7000 BGA, 20x20 grid, 17x17mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition Appendix A Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=278, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=92, NSMD pad definition Appendix A Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=271, ttps://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=281, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=82, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole IDC header, 2x15, 2.54mm pitch, double rows Through hole angled socket strip, 2x16.

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