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CASE 122BS (see ON Semiconductor 505AB.PDF DFN22 6*5*0.9 MM, 0.5 P; CASE 506AF\xe2\x88\x9201 (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic Shrink Small Outline Package (MS) [MSOP] (see Microchip Packaging Specification 00000049BS.pdf TQFP, 48 Pin (https://www.espressif.com/sites/default/files/documentation/esp32_datasheet_en.pdf#page=38), generated with kicad-footprint-generator Molex LY 20 series connector, BM11B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator JST VH series connector, 502443-0570 (http://www.molex.com/pdm_docs/sd/5024430270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py TQFN, 40.

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