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Number 2366C888-007 Molex 47053-1000, Foxconn HF27040-M1, Tyco 1470947-1 or equivalent, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header SMD 1x40 2.00mm single row style2 pin1 right Through hole angled pin header THT 1x38 2.00mm single row style2 pin1 right Through hole angled socket strip THT 2x35 1.27mm double row Through hole angled pin header SMD 1x40 2.54mm single row style2 pin1 right Through hole angled socket strip THT 1x40 2.00mm single row Through hole angled pin header SMD 1x23 2.54mm single row style1 pin1 left Surface mounted socket strip THT 1x04 2.54mm single row Through hole straight socket strip, 2x34, 2.00mm pitch, single row Through hole angled pin header, 2x07, 2.54mm pitch, 8.51mm socket length, single row style1 pin1 left Surface mounted pin header THT 2x23 1.00mm double row surface-mounted straight pin header, 2x35, 2.54mm pitch, single row (from Kicad 4.0.7), script generated Through hole pin header SMD 1x28 1.27mm single row Through hole pin header THT 2x40 2.54mm double row Through hole angled pin header, 2x35, 2.00mm pitch, 4.2mm pin length, single row (from Kicad 4.0.7), script generated Through hole socket strip THT 1x18 2.54mm single row Through hole straight socket strip, 2x27, 1.27mm pitch, 4.4mm socket length, single row Through hole angled pin header THT 2x13 2.00mm double row surface-mounted straight pin header, 2x19, 2.54mm pitch, double rows Through hole socket strip THT 1x06 2.00mm single row Through hole Samtec HPM power header series 11.94mm post length, 1x11, 5.08mm pitch, see http://www.vishay.com/docs/88656/kbu4.pdf Vishay KBU rectifier diode bridge ABS (Diotec), see https://diotec.com/tl_files/diotec/files/pdf/datasheets/abs2.pdf SMD package for diode bridges, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 3x-dip-switch SPST Omron_A6S-310x, Slide, row spacing 7.62 mm (300 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 18-lead though-hole mounted.

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