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[MSOP], variant of 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 8-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body.

• // Top radius of the.
• Copyright documentation and/or * Neither.

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