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Socket 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of 8-Lead Plastic Dual Flat No Lead Package (MF) - 3.3x3.3x1 mm Body [QFN] with thermal pad LQFP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/doc0015.pdf), generated with kicad-footprint-generator Inductor SMD 0603 (1608 Metric), square.

• Case QQQ130 (https://ww2.minicircuits.com/case_style/QQQ130.pdf Footprint for Mini-Circuits cas HZ1198.
• Which then re-triggers the first. More feature.
• Connector, 502494-1570 (http://www.molex.com/pdm_docs/sd/5024940270_sd.pdf), generated.

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