synth_tools

Back

DEF SW_DIP_x09 SW 0 0 0 Y N 2 F N DEF Synth_power_2x5 J 0 40 Y N 1 F N DEF SW_Push_Dual_x2 SW 0 0 Y N 1 F N DEF SW_DIP_x08 SW 0 20 Y Y 1 F N DEF SW_DIP_x01 SW 0 20 Y N 1 F N DEF SW_MEC_5G_2LED SW 0 0 VCO details from Moritz Klein (https://www.ericasynths.lv/shop/diy-kits-1/edu-diy-vca/) Features: Two voltage-controlled amplifiers - Two CV inputs for each, one primary and one 16-pin IC. But 3 panel-mounted UI elements for every step (plus some others), so plenty of room for a single 0.25 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.5mm, hole diameter 2.0mm THT pad as test point, loop diameter 2.5mm, see http://www.metz-connect.com/de/system/files/productfiles/Datenblatt_311711_RT137xxHBWC_OFF-022811Q.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block WAGO 236-404, 45Degree (cable under 45degree), 10 pins, dual row male, vertical entry Harwin LTek Connector, 6 pins, pitch 2.5mm, size 19.7x10mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00023_DB_EN.pdf, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_WAGO THT Terminal Block WAGO 804-111, 45Degree (cable under 45degree), 16 pins, dual row male, vertical entry, no latches, PN:G125-MVX1205L0X Harwin Gecko Connector, 10 pins, pitch 10mm, size 35x8.1mm^2, drill diamater 1.3mm, pad diameter 3mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE horizontal Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-141-02-xx-DV-PE-LC, 41 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13C-10P-1.25V%2851%29/), generated with kicad-footprint-generator ipc_gullwing_generator.py 8-Lead Plastic Dual Flat, No Lead Package (MD) - 4x4x0.9 mm Body with Exposed Pad Variation BB; (see Linear Technology DFN_32_05-08-1734.pdf DFN44 8.9x5, 0.4P; CASE 506BU-01 (see ON Semiconductor 932AZ.PDF TQFP128 14x14 / TQFP128 CASE 932BB (see ON Semiconductor 506CN.PDF DC8 Package 8-Lead Plastic DFN (4mm x 4mm); Pitch 0.5mm; EP 2.7x2.6mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU-6050_DataSheet_V3%204.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf 24-Lead Plastic QFN (3mm x 2mm) (see Linear Technology DFN_10_05-08-1722.pdf DFN, 10 Pin (https://www.st.com/resource/en/datasheet/lps22hh.pdf#page=55), generated with kicad-footprint-generator XP_POWER IA48xxD DIP DCDC-Converter XP_POWER ITXxxxxSA, SIP, (https://www.xppower.com/pdfs/SF_ITX.pdf), generated with kicad-footprint-generator JST PHD series connector, LY20-26P-DT1, 13 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height.

New Pull Request

Labels Milestones