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Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small Outline (SO) - Wide, 5.3 mm Body with Exposed Pad [eTSSOP] (see Microchip Packaging.

• -4.138940e-03 8.397109e-02 vertex -1.093935e+02 9.725134e+01 1.047174e+01 facet normal.
• 0.365754 -0.300169 0.880978 facet normal -0.714682 0.5865 0.381114.
• SmallPads 42-lead though-hole mounted DIP package, row spacing.

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