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CTS_Series194-9MSTN, Piano, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 25.4 mm (1000 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 24-lead though-hole mounted DIP package, row spacing.

2.08528 9.21464 3.54602 vertex.
System, 53047-1210, 12 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated.
Locator, 6 Pins per row.
Normal -0.257261 -0.262755 0.929934 vertex -4.99768 5.42659 6.90571.
BGA-153 M153 MBGA Altera VBGA V81 BGA-81 Altera.

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