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(2012-12 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20052/crcw0201e3.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 2 times 0.25 mm² wires, basic insulation, conductor diameter 1.4mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-62XX, 6 Pins per row (https://www.hirose.com/product/en/products/DF63/), generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/12-H-5.0 Terminal Block, 1719354 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1719354), generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 32 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8153-8-and-16-bit-avr-microcontroller-xmega-e-atxmega8e5-atxmega16e5-atxmega32e5_datasheet.pdf#page=70), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.25 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-E 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py USON, 6 Pin (https://www.silabs.com/documents/public/data-sheets/Si7020-A20.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-139-02-xxx-DV-LC, 39 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py AMS OLGA, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-8127-AVR-8-bit-Microcontroller-ATtiny4-ATtiny5-ATtiny9-ATtiny10_Datasheet.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, B13B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator connector Molex SPOX Connector System, 53048-0410, 4 Pins per row (https://cdn.harwin.com/pdfs/M20-890.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOT, 5 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.4715x1.4715mm, 9 bump 3x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FB676 FBG676 FBV676 Kintex-7 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=261, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=302, NSMD pad definition (http://www.ti.com/lit/ml/mxbg270/mxbg270.pdf Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, 4x4mm body, pitch 0.5mm, see http://www.ti.com/lit/ds/symlink/tps62177.pdf WSON-10 package 2x3mm body, pitch 0.5mm, thermal vias in pads, 2 Pins per row (http://www.molex.com/pdm_docs/sd/428192214_sd.pdf), generated with kicad-footprint-generator JST SHL series connector, S12B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator JST SUR series connector, SM13B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole 4.5mm, height 6, Wuerth electronics 9771060360 (https://katalog.we-online.com/em/datasheet/9771060360.pdf), generated with kicad-footprint-generator JST SH series.

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