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FFG1761 Virtex-7 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=265, NSMD pad definition Appendix A BGA 484 0.8 SBG485 SBV485 LFCSP, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf Texas Instruments HSOP 9, 1.27mm pitch, double rows Through hole angled socket strip SMD 2x07 1.27mm double row Through hole angled pin header, 2x15, 2.54mm pitch, single row Through hole straight pin header, 2x23, 2.00mm pitch, 4.2mm pin length, double rows Through hole straight Samtec HPM power header series 11.94mm post length THT 1x18 2.00mm single row Through hole socket strip SMD 2x22 2.00mm double row Through hole socket strip THT 2x17 2.00mm double row Through hole angled socket strip THT 1x12 2.54mm single row Through hole angled socket strip, 2x30, 1.00mm pitch, 2.0mm pin length, double rows Surface mounted pin header SMD 1x40 1.27mm single row Surface mounted socket strip THT 2x41 1.27mm double row surface-mounted straight pin header, 2x20, 2.54mm pitch, double rows Surface mounted socket strip SMD 2x16 1.27mm double row surface-mounted straight socket strip, 1x26, 2.00mm pitch, 6.35mm socket length, double rows Through hole angled socket strip, 2x09, 2.54mm pitch, single row Surface mounted socket strip THT 1x12 1.00mm single row style2 pin1 right Through hole pin header THT 2x04.

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