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HLE-146-02-xxx-DV-A, 46 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 4-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD DIP Switch SPST Slide 7.62mm 300mil Vishay HVMDIP HEXDIP DirectFET L4 MOSFET Infineon DirectFET SH MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET SB MOSFET Infineon DirectFET MQ MOSFET Infineon DirectFET ST MOSFET Infineon DirectFET MX MOSFET Infineon DirectFET MF MOSFET Infineon DirectFET S3C MOSFET Infineon DirectFET MN MOSFET Infineon DirectFET MU MOSFET Infineon DirectFET SJ MOSFET Infineon PLCC, 20 pins, through hole 3.2mm, height 3.1, Wuerth electronics 9776040960 (https://katalog.we-online.com/em/datasheet/9776040960.pdf), generated with kicad-footprint-generator Tantalum Capacitor SMD 1812 (4532 Metric), square (rectangular) end terminal, IPC_7351 nominal with elongated pad for handsoldering. (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1330, 13 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator Harwin Female Vertical Surface Mount Tactile Switch for High-Density Packaging Surface Mount.

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