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Through-hole, row spacing 10.16 mm (400 mils 12-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), Socket 12-lead though-hole mounted DIP package, row spacing 7.62 mm (300.

• Normal 0.555573 -0.831468 7.7622e-07.
• 1.87509 -9.81814 0.0427034 vertex 2.0535.
• -0.472795 -0.88053 0.0336363 facet normal 0.0819182 0.0817958 -0.993277.
• 0.705983 vertex 2.42348 -0.642209 19.4867 facet normal -0.081813.

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